Apparatus for surface mount connectors

ABSTRACT

Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

BACKGROUND

Generally, soldering is an elemental process in the manufacture ofelectronic equipment. Soldering allows for two or more components to bejoined together by melting and placing a filler material, such assolder, into a joint formed between the two or more components.Soldering may be utilized as it enables electrical conductivity andprovides at least some mechanical strength. Soldering may be carried outthrough the application of heat generated by, for example, a solderingiron or oven.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying Figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale. In fact, the dimensions of the variousfeatures may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-3 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 4 is a cutaway view of the apparatus of FIGS. 1-3 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 5-7 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 8 is a cutaway view of the apparatus of FIGS. 5-7 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 9-11 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 12 is a cutaway view of the apparatus of FIGS. 9-11 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 13-15 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 16 is a cutaway view of the apparatus of FIGS. 13-15 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 17-19 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 20 is a cutaway view of the apparatus of FIGS. 17-19 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 21-23 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 24 is a cutaway view of the apparatus of FIGS. 21-23 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 25-27 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 28 is a cutaway view of the apparatus of FIGS. 25-27 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 29-31 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 32 is a cutaway view of the apparatus of FIGS. 29-31 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 33A-35A are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIGS. 33B-35B are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 36A is a cutaway view of the apparatus of FIGS. 33A-35A coupled toa surface mount connector, according to one or more examples of thedisclosure.

FIG. 36B is a cutaway view of the apparatus of FIGS. 33B-35B coupled toa surface mount connector, according to one or more examples of thedisclosure.

FIGS. 37-39 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 40 is a cutaway view of the apparatus of FIGS. 37-39 coupled to asurface mount connector, according to one or more examples of thedisclosure.

FIGS. 41-43 are respective front, side, and top views of an apparatus,according to one or more examples of the disclosure.

FIG. 44 is a cutaway view of the apparatus of FIGS. 41-43 coupled to asurface mount connector, according to one or more examples of thedisclosure.

DETAILED DESCRIPTION

Illustrative examples of the subject matter claimed below will now bedisclosed. In the interest of clarity, not all features of an actualimplementation are described in this specification. It will beappreciated that in the development of any such actual implementation,numerous implementation-specific decisions may be made to achieve thedevelopers' specific goals, such as compliance with system-related andbusiness-related constraints, which will vary from one implementation toanother. Moreover, it will be appreciated that such a developmenteffort, even if complex and time-consuming, would be a routineundertaking for those of ordinary skill in the art having the benefit ofthis disclosure.

Further, as used herein, the articles “a” and “an” are intended to havetheir ordinary meaning in the patent arts, namely “one or more.”Moreover, examples herein are intended to be illustrative only and arepresented for discussion purposes and not by way of limitation.

Modern module manufacturing has evolved from wired components mostlyassembled by hand, to surface-mounted components assembled in anautomated process referred to generally as surface mount technology(SMT). SMT may be used to assemble surface mount devices (SMDs)comprised of surface mount components mounted to a substrate, such as aprinted circuit board (PCB). SMT enables module manufacturing to beoptimized with regard to a cost-effective, high-quality, and lesserror-prone production process.

To mount a surface mount connector to a PCB, the surface mount connectorhas solderable connection surfaces (e.g., leads) that are soldereddirectly onto a surface of the PCB. To facilitate the foregoing, contactsurfaces, generally referred to as pads, on the top and/or bottom sideof the PCB are printed with solder paste. The solder paste may be, forexample, a mixture of solder powder and flux. The leads of the surfacemount connector are set into the solder paste on the PCB and thensoldered in a reflow oven.

In the reflow oven, the solder paste is subjected to heat energy, e.g.,infrared radiation, and heated to the liquidus temperature of thesolder, at which time the solder melts. As the solder cools andsolidifies, the solder joins the connector leads to the pads of the PCB,thereby forming solid solder joints in a cool-down zone of the reflowoven. The SMD, also referred to as a printed circuit assembly (PCA), maythen be manually inspected or passed through a machine, such as anAutomatic Optical Inspection (AOI) machine, which runs a number ofvisual quality checks on the SMD. Such visual quality checks mayinclude, for example, alignment of the surface mount connectors andchecking for solder bridges. After exiting the AOI machine, the SMD maybe subjected to further inspection and testing based on standardoperating practices of the manufacturer.

As the solder paste is heated in the reflow oven, the surface mountconnector(s) in the reflow oven are also subjected to heat energy (e.g.,infrared radiation). Accordingly, surface mount connectors are generallyconstructed from plastic materials, such as polyamides, liquid crystalpolymers, and polycyclohexylenedimethylene terephthalate (PCT), havingshort-term, high temperature resistance. The plastic material may beselected based on factors, such as, for example, the planned geometry ofthe surface mount connector, the temperature load in the reflow oven,and economic considerations, such as the planned expenditure forpackaging.

Although constructed from short-term, high temperature resistant plasticmaterials, some surface mount connectors may deform in response to beingsubjected to the heat energy in the reflow oven. For example, surfacemount connectors, such as DDR4 connectors and DDR5 connectors(collectively referred to as DDRx connectors), may deform (e.g., warp)such that end portions thereof may lift from the PCB in the reflow oven.The lifting of each end portion causes lifting of the leads from therespective contact surfaces of the PCB, which may result in anun-reliable connection (partially lifted lead) or, in some cases, anopen connection (fully lifted lead).

To prevent deformation of the surface mount connectors, in someinstances, weight blocks are disposed on top of the end portions of abank of surface mount connectors in an effort to keep the end portionsof the surface mount connectors flat and in contact with the PCB duringthe soldering process within the heat flow oven. Although potentiallyeffective in keeping the end portions of the surface mount connectorsflat and in contact with the PCB, the addition of weight blocks hascertain drawbacks.

For example, one such drawback is that adding the weight blocks to thebank of surface mount connectors acts to tie the position of all the SMTconnectors into a positional unit, interfering with the ability of eachconnector's solder joints to “float” into ideal alignment, which isnormally accomplished by surface tension of the molten solder across allconnector PCB pads. Another example drawback is that adding the weightblocks to a surface mount connector may introduce higher risks of coldjoint formations at their locations in case of thermal-profilevariations. Still further, another example drawback is that addingweight blocks may cause significantly shorter solder joint stand-offheight which may directly affect solder joint reliability.

Accordingly, examples of the present disclosure are directed toapparatus for reducing, and in some instances, preventing thedeformation of surface mount connectors subjected to heat energy whileaddressing the drawbacks provided above. In particular, the apparatus ofthe present disclosure enables: a lack of interference with theself-alignment of the leads of the surface mount connector;substantially reduced risk of cold joint formations for a given thermalprofile; and minimum solder joint variability throughout theconnections.

More particularly, in one example of the present disclosure, anapparatus may include an elongated body to couple with a surface mountconnector to reduce or prevent deformation of the surface mountconnector during soldering of the surface mount connector to asubstrate. The surface mount connector may include a connector housinghaving a first end portion and a second end portion. The elongated bodymay include a center body portion, a first side body portion, and asecond side body portion. The center body portion may have alongitudinal axis and a lateral axis and may extend along thelongitudinal axis from the first end portion to the second end portionwhen coupled to the surface mount connector. The first side body portionmay extend from a first lateral end portion of the center body portion.The second side body portion may extend from a second lateral endportion of the center body portion opposing the first lateral endportion. The first side body portion and the second side body portionmay couple the elongated body with the surface mount connector.

In another example of the present disclosure, an apparatus may includean elongated body to couple with a surface mount connector to reduce orprevent deformation of the surface mount connector during soldering ofthe surface mount connector to a substrate. The surface mount connectormay include a connector housing having a first end portion and a secondend portion. The elongated body may include a first side body portionand a second side body portion. The first body end portion may form afirst tab insertable into a socket defined by the first housing endportion, and the second body end portion may form a second tabinsertable into a socket defined by the second housing end portion.

In another example of the present disclosure, an apparatus may includean elongated body to couple with a surface mount connector to reduce orprevent deformation of the surface mount connector during soldering ofthe surface mount connector to a substrate. The surface mount connectormay include a connector housing having a first end portion and a secondend portion. The elongated body may include a vertically extendingportion insertable within a socket defined by the connector housing ofthe surface mount connector, such that the elongated body may extendfrom the first end portion to the second end portion of the connectorhousing.

Turning now to the drawings, FIGS. 1-3 illustrate respective front,side, and top views of an apparatus 100, and FIG. 4 is a cutaway view ofthe apparatus 100 of FIGS. 1-3 coupled to a surface mount connector 400,according to one or more examples of the disclosure. The apparatus 100may be configured to couple to the surface mount connector 400 prior toa pick and place operation or, in other examples, after the surfacemount connector 400 is set into a solder paste disposed on a substrate,such as a printed circuit board (PCB) (402, FIG. 4), during an automatedmanufacturing process referred to in the art as surface mount technology(SMT). Example surface mount connectors 400 may include SMT DDR4connectors and SMT DDR5 connectors (referred to collectively herein asSMT DDRx connectors). However, the present disclosure is not limitedthereto, and other example surface mount connectors may include anynarrow, cartridge-type connector mountable during SMT, such as, forexample, high speed bus interface and Peripheral Connector InterconnectExpress (PCIe) connectors.

The apparatus 100 may be further configured to reduce, and in someinstances, prevent deformation (e.g., warpage) of the surface mountconnector 400 subjected to heat energy in a reflow oven during SMT. Tothat end, the apparatus 100 may be constructed from a heat resistantmaterial, such as steel, ceramic, or titanium, and may include anelongated, inverted U-shaped body 102 extending longitudinally andhaving a center body portion 104 and two side body portions 106. Asillustrated in FIGS. 1-3, each side body portion 106 may extend from thecenter body portion 104 at a respective lateral end thereof in adirection substantially perpendicular (within +/−10 degrees of a rightangle) to a lateral axis 105 and a longitudinal axis 107 of the centerbody portion 104. In one or more examples, the side body portions 106may be substantially parallel (within +/−10 degrees) to one another, andeach side body portion 106 may include an inner surface 108 opposing andfacing the inner surface 108 of the other side body portion 106.

The inner surfaces 108 of the side body portions 106 may each include aplurality of protrusions 110 extending therefrom. Additionally, in oneor more implementations, the inner surfaces 106 may define a pluralityof apertures or slots (not shown) to aid in the radiant heat transferinto the surface mount connector 400. As illustrated in FIGS. 1-3, eachinner surface 108 may include four equally-spaced protrusions 110 havinga cylindrical shape; however, the present disclosure is not limitedthereto, and in other examples, each inner surface 108 may have two,three, or five or more protrusions 110, and one or more protrusions 110may have a polygonal shape. Further, in some examples, the protrusions110 may be inconsistently spaced and/or one inner surface 108 may havefewer protrusions 110 than the other inner surface 108.

As illustrated in FIG. 4, the surface mount connector 400 may include aconnector housing 404 defining a socket 406 extending between opposingend portions 408 of the connector housing 404. Although only one endportion 408 is shown for purposes of the cutaway view, those of skill inthe art will appreciate that the end portions 408 are the same in formand function. Each end portion 408 of the connector housing may includea tower 410 further defining the socket 406. Each tower 410 may furtherinclude a latch 412 to secure an electronic component (e.g., dual inlinememory module (DIMM)—not shown) within the socket 406.

The connector housing 404 may have a first outer wall 414 extendingbetween the opposing end portions 408 and a second outer wall 416extending between the opposing end portions 408 and opposing the firstouter wall 414. Each of the first outer wall 414 and the second outerwall 416 may define a plurality of cavities 418 sized and configured toreceive a respective protrusion 110 of the plurality of protrusions 110of the apparatus 100 when coupled thereto. In one or more examples, thecavities 418 may be pre-molded in the first outer wall 414 and thesecond outer wall 416 of the connector housing 404.

To couple the apparatus 100 to the surface mount connector 400 asillustrated in FIG. 4, the apparatus 100 is placed over the surfacemount connector 400 such that each side body portion 106 of theapparatus 100 is placed into contact with a respective outer wall 414,416 of the surface mount connector 400. Each protrusion 110 of theapparatus 100 is guided and inserted into a respective cavity 418 of theconnector housing 404, thereby coupling the apparatus 100 to the surfacemount connector 400.

As coupled to the surface mount connector 400, the apparatus 100provides structural rigidity to the surface mount connector 400.Accordingly, during the application of heat energy to the surface mountconnector 400 in, for example, a reflow oven, and thereafter as thesolder cools, the apparatus 100 reduces, and in some instances, preventsthe end portions 408 of the surface mount connector 400 from lifting offthe PCB 402 or otherwise warping in shape, thereby resulting in thesurface mount connector 400 remaining flat (i.e., without curvature)during the thermal excursion of the soldering process. As a result ofsuch, the solder forms appropriate solder joints and an acceptableconnection is made between the leads of the surface mount connector 400and the PCB 402. After SMT, the apparatus 100 may be decoupled from thesurface mount connector 400 and an electronic component (e.g., DIMM—notshown) may be inserted into the socket 406.

Referring now to FIGS. 5-8, respective front, side, and top views of anapparatus 500 are shown in FIGS. 5-7, and FIG. 8 is a cutaway view ofthe apparatus 500 coupled to the surface mount connector 400, accordingto one or more examples of the disclosure. The apparatus 500 may besimilar in some aspects to the apparatus 100, and thus, like numberswill refer to like components, which will not be discussed again indetail for the sake of brevity. The apparatus 500 may include a centersupport 502 extending from the center body portion 104 between and in asubstantially parallel arrangement (within +/−10 degrees) with the sidebody portions 106. The center support 502 may be sized and configured tobe inserted into the socket 406 of the surface mount connector 400 atleast as far as an electronic component (not shown) would be inserted.Accordingly, in one or more examples, the center support 502 may bethinner than an electronic component, such as a DIMM. As inserted intothe socket 406, the center support 502 adds additional reinforcement toprevent the surface mount connector 400 from deforming during SMT.

To couple the apparatus 500 to the surface mount connector 400 asillustrated in FIG. 8, the apparatus 500 is placed over the surfacemount connector such that each side body portion 106 of the apparatus500 is placed into contact with a respective outer wall 414, 416 of thesurface mount connector 400. In addition, the center support 502 may beguided into alignment with the socket 406. As the center support 502 isinserted into the socket 406 of the surface mount connector 400, eachprotrusion 110 of the apparatus 500 is guided and inserted into arespective cavity 418 of the connector housing 404, thereby coupling theapparatus 500 to the surface mount connector 400.

As coupled, the apparatus 500 provides structural rigidity to thesurface mount connector 400. The addition of the center support 502 mayprovide enhanced structural support relative to the apparatus 100 ofFIG. 14. Accordingly, during the application of heat energy to thesurface mount connector 400 in, for example, a reflow oven, andthereafter as the solder cools, the apparatus 500 reduces, and in someinstances, prevents the end portions 408 of the surface mount connector400 from lifting off the PCB 402 or otherwise warping in shape, therebyresulting in the surface mount connector 400 remaining flat (i.e.,without curvature) during the thermal excursion of the solderingprocess. As a result of such, the solder forms appropriate solder jointsand an acceptable connection is made between the leads of the surfacemount connector 400 and the PCB 402. After SMT, the apparatus 500 may bedecoupled from the surface mount connector 400 and an electroniccomponent (e.g., DIMM—not shown) may be inserted into the socket 406.

Turning now to FIGS. 9-12, respective front, side, and top views of anapparatus 900 are shown in FIGS. 9-11, and FIG. 12 is a cutaway view ofthe apparatus 900 coupled to a surface mount connector 1200, accordingto one or more examples of the disclosure. The apparatus 900 and thesurface mount connector 1200 may be similar in some aspects to therespective apparatus 100 and surface mount connector 400; thus, likenumbers will refer to like components, which will not be discussed againin detail for the sake of brevity.

As illustrated in FIGS. 9-11, the inner surfaces 108 of the side bodyportions 106 may each include a plurality of protrusions 902. In one ormore examples, the plurality of protrusions 902 may include a pluralityof spikes. In other implementations, the protrusions 902 may be ridges,knurls, or stamped patterns. As illustrated in FIGS. 9-11, the pluralityof protrusions 902 may be arranged in an array; however, the presentdisclosure is not limited thereto, and in other examples, the pluralityof protrusions 902 may be arranged randomly or in any pattern suitableto couple the apparatus 900 to the surface mount connector 1200 toreduce, or in some cases, prevent deformation of the surface mountconnector 1200.

The surface mount connector 1200 may differ from surface mount connector400 in that the cavities 418 may be omitted from the connector housing404. Accordingly, to couple the apparatus 900 to the surface mountconnector 1200 as illustrated in FIG. 12, the apparatus 900 is placedover the surface mount connector 1200 such that each side body portion106 of the apparatus 900 is placed into contact with a respective outerwall 414, 416 of the surface mount connector 1200. Each protrusion 902of the apparatus 900 grips a respective outer wall 414, 416 of theconnector housing 404, thereby coupling the apparatus 900 to the surfacemount connector 1200.

As coupled to the surface mount connector 1200, the apparatus 900provides structural rigidity to the surface mount connector 1200.Accordingly, during the application of heat energy to the surface mountconnector 1200 in, for example, a reflow oven, and thereafter as thesolder cools, the apparatus 900 reduces, and in some instances, preventsthe end portions 408 of the surface mount connector 1200 from liftingoff the PCB 402 or otherwise warping in shape, thereby resulting in thesurface mount connector 1200 remaining flat (i.e., without curvature)during the thermal excursion of the soldering process. As a result ofsuch, the solder forms appropriate solder joints and an acceptableconnection is made between the leads of the surface mount connector 1200and the PCB 402. After SMT, the apparatus 900 may be decoupled from thesurface mount connector 1200 and an electronic component (e.g., DIMM—notshown) may be inserted into the socket 406.

Referring now to FIGS. 13-16, respective front, side, and top views ofan apparatus 1300 are shown in FIGS. 13-15, and FIG. 16 is a cutawayview of the apparatus 1300 coupled to the surface mount connector 1200,according to one or more examples of the disclosure. The apparatus 1300may be similar in some aspects to the apparatus 100, and thus, likenumbers will refer to like components, which will not be discussed againin detail for the sake of brevity. The side body portions 106 of theapparatus 1300 may include respective lips 1302 extending inward fromend portions 1304 of the side body portions 106. As configured, each lip1302 is angled to engage with a respective angled in-step 1202 definedby the respective first outer wall 414 and second outer wall 416 of theconnector housing 404. Accordingly, in view of the lips 1302, theprotrusions 110 as detailed in the apparatus 100 of FIG. 1 may beomitted from the inner surfaces 108 of the side body portions 106 of theapparatus 1300. Additionally, in one or more implementations, the innersurfaces 106 may define a plurality of apertures or slots (not shown) toaid in the radiant heat transfer into the connector housing 404 of thesurface mount connector 1200.

To couple the apparatus 1300 to the surface mount connector 1200 asillustrated in FIG. 16, the apparatus 1300 is placed over the surfacemount connector 1200 such that each side body portion 106 of theapparatus 1300 is placed into contact with a respective outer wall 414,416 of the connector housing 404. Each lip 1302 of the apparatus 1300 isguided into engagement with a respective angled in-step 1202, therebycoupling the apparatus 1300 to the surface mount connector 1200.

As coupled to the surface mount connector 1200, the apparatus 1300provides structural rigidity to the surface mount connector 1200.Accordingly, during the application of heat energy to the surface mountconnector 1200 in, for example, a reflow oven, the apparatus 1300reduces, and in some instances, prevents the end portions 408 of thesurface mount connector 1200 from lifting off the PCB 402 or otherwisewarping in shape, thereby resulting in the surface mount connector 1200remaining flat (i.e., without curvature) during the thermal excursion ofthe soldering process. As a result of such, the solder forms appropriatesolder joints and an acceptable connection is made between the leads ofthe surface mount connector 1200 and the PCB 402. After SMT, theapparatus 1300 may be decoupled from the surface mount connector 1200and an electronic component (e.g., DIMM—not shown) may be inserted intothe socket 406.

Turning now to FIGS. 17-20, respective front, side, and top views of anapparatus 1700 are shown in FIGS. 17-19, and FIG. 20 is a cutaway viewof the apparatus 1300 coupled to the surface mount connector 1200,according to one or more examples of the disclosure. The apparatus 1700may be similar in some aspects to the apparatus 1300, and thus, likenumbers will refer to like components, which will not be discussed againin detail for the sake of brevity. The apparatus 1700 may include acenter support 1702 extending from the center body portion 104 betweenand in a substantially parallel arrangement (within +/−10 degrees) withthe side body portions 106. The center support 1702 may be sized andconfigured to be inserted into the socket 406 of the surface mountconnector 1200 at least as far as an electronic component would beinserted. Accordingly, in one or more examples, the center support 1702may be thinner than an electronic component, such as a DIMM. As insertedinto the socket 406, the center support 1702 adds additionalreinforcement to prevent the surface mount connector 1200 from deformingduring SMT.

To couple the apparatus 1700 to the surface mount connector asillustrated in FIG. 20, the apparatus 1700 is placed over the surfacemount connector 1200 such that each side body portion 106 of theapparatus 1700 is placed into contact with a respective outer wall 414,416 of the surface mount connector 1200. As the center support 1702 isinserted into the socket 406 of the surface mount connector 1200, eachlip 1302 of the apparatus 1700 is guided into engagement with arespective angled in-step 1202, thereby coupling the apparatus 1700 tothe surface mount connector 1200.

As coupled, the apparatus 1700 provides structural rigidity to thesurface mount connector 1200. The addition of the center support 1702may provide enhanced structural support relative to the apparatus 1300of FIGS. 13-16. Accordingly, during the application of heat energy tothe surface mount connector 1200 in, for example, a reflow oven, andthereafter as the solder cools, the apparatus 1700 reduces, and in someinstances, prevents the end portions 408 of the surface mount connector1200 from lifting off the PCB 402 or otherwise warping in shape, therebyresulting in the surface mount connector 1200 remaining flat (i.e.,without curvature) during the thermal excursion of the solderingprocess. As a result of such, the solder forms appropriate solder jointsand an acceptable connection is made between the leads of the surfacemount connector 1200 and the PCB 402. After SMT, the apparatus 1700 maybe decoupled from the surface mount connector 1200 and an electroniccomponent (e.g., DIMM—not shown) may be inserted into the socket 406.

Turning now to FIGS. 21-24, respective front, side, and top views of anapparatus 2100 are shown in FIGS. 21-23, and FIG. 24 is a cutaway viewof the apparatus 2100 coupled to the surface mount connector 400,according to one or more examples of the disclosure. The apparatus 2100may be similar in some aspects to the apparatus 100 of FIGS. 1-4, andthus, like numbers will refer to like components, which will not bediscussed again in detail for the sake of brevity.

The apparatus 2100 may include two side body portions 2102, each sidebody portion 2102 extending from the center body portion 104 at arespective lateral end thereof and in an opposing direction from sidebody portions 106. In one or more examples, the side body portions 2102may be substantially parallel (within +/−10 degrees) to one another,such that the body 102 is substantially H-shaped. The structure andcomposition of the body 102 may allow for the side body portions 2102 toserve as an actuating portion of a clamp or clip, in that forcing eachside body portion 2102 toward one another permits the pivoting outwardof side body portions 106 and the removal of a force to each side bodyportion 2102 permits the side body portions 106 to return to theirresting position (i.e., original state). As such, the side body portions2102 facilitate the placement and removal of the apparatus 2100 from thesurface mount connector 400.

By way of example, to couple apparatus 2100 to surface mount connector400, the apparatus 2100 is placed over the surface mount connector 400such that each side body portion 106 of the apparatus 100 is placed intocontact with a respective outer wall 414, 416 of the surface mountconnector 400. At or before this time, a force may be applied to theside body portions 2102 forcing the side body portions 2102 toward oneanother, and thereby causing the side body portions 106 to pivot outwardaway from one another. Each protrusion 110 of the apparatus 2100 maythen be guided and inserted into a respective cavity 418 of theconnector housing 404, thereby coupling the apparatus 2100 to thesurface mount connector 400. The force on the side body portions 2102may be removed, and the side body portions 106 may pivot back inward totheir original position.

As coupled to the surface mount connector 400, the apparatus 2100provides structural rigidity to the surface mount connector 400.Accordingly, during the application of heat energy to the surface mountconnector 400 in, for example, a reflow oven, the apparatus 2100reduces, and in some instances, prevents the end portions 408 of thesurface mount connector 400 from lifting off the PCB 402 or otherwisewarping in shape, thereby resulting in the surface mount connector 400remaining flat (i.e., without curvature) during the thermal excursion ofthe soldering process. As a result of such, the solder forms appropriatesolder joints and an acceptable connection is made between the leads ofthe surface mount connector 400 and the PCB 402. After SMT, theapparatus 2100 may be decoupled from the surface mount connector 400 andan electronic component (e.g., DIMM—not shown) may be inserted into thesocket 406.

To decouple the apparatus 2100 from the surface mount connector 400, aforce may be applied to the side body portions 2102 forcing the sidebody portions 2102 toward one another, and thereby causing the side bodyportions 106 to pivot outward away from one another. Each protrusion 110of the apparatus 2100 may be guided out of a respective cavity 418 ofthe connector housing 404, thereby decoupling the apparatus 2100 fromthe surface mount connector 400.

Although the side body portions 2102 are illustrated with respect toapparatus 2100, it will be appreciated that the side body portions 2102may be included in any of apparatus 100, 500, 900, 1300, and 1700 andthus may be utilized with respect to the surface mount connector 1200 inaddition to the surface mount connector 400.

Turning now to FIGS. 25-28, respective front, side, and top views of anapparatus 2500 are shown in FIGS. 25-27, and FIG. 28 is a cutaway viewof the apparatus 2500 coupled to the surface mount connector 1200,according to one or more examples of the disclosure. The apparatus 2500may be configured to reduce, and in some instances, prevent deformation(e.g., warpage) of the surface mount connector 1200 subjected to heatenergy during SMT.

To that end, the apparatus 2500 may include a T-shaped body 2502 incross section including a vertically extending portion 2504 and ahorizontally extending portion 2506. The T-shaped body 2502 may be sizedto extend between towers 410 of the surface mount connector 1200 and mayinclude opposing end portions 2508, where each end portion 2508 includesa tab 2510 extending from the vertically extending portion 2504 and thehorizontally extending portion 2506. In one or more examples, each tab2510 extends from the vertically extending portion 2504, such that theheight of the apparatus 2500 at each end portion 2508 mimics the heightof a DIMM. Accordingly, as configured, the vertically extending portion2504 may be inserted into the socket 406 of the surface mount connector1200 such that the horizontally extending portion 2506 rests on a topsurface 1204 of the surface mount connector 1200 and each tab 2510 mayengage with a respective latch 412 of the surface mount connector 1200.In some examples, each tab 2510 may define a notch (not shown)configured to further engage with the latch 412.

To couple the apparatus 2500 to the surface mount connector 1200, thevertically extending portion 2504 may be guided into alignment with andinserted into the socket 406 of the surface mount connector 1200 untilthe horizontally extending portion 2506 contacts the top surface 1204 ofthe surface mount connector 1200. In addition, each latch 412 may atleast partially extend over and engage with a respective tab 2510 ateach end portion 2508 of the T-shaped body 2502 to further couple theapparatus 2500 to the surface mount connector 1200.

As coupled to the surface mount connector 1200, the apparatus 2500provides structural rigidity to the surface mount connector 1200.Accordingly, during the application of heat energy to the surface mountconnector 1200 in, for example, a reflow oven, and thereafter as thesolder cools, the apparatus 2500 reduces, and in some instances,prevents the end portions 408 of the surface mount connector 1200 fromlifting off the PCB 402 or otherwise warping in shape, thereby resultingin the surface mount connector 1200 remaining flat (i.e., withoutcurvature) during the thermal excursion of the soldering process. As aresult of such, the solder forms appropriate solder joints and anacceptable connection is made between the leads of the surface mountconnector 1200 and the PCB 402. After SMT, the apparatus 2500 may bedecoupled from the surface mount connector 1200 and an electroniccomponent (e.g., DIMM—not shown) may be inserted into the socket 406.

Turning now to FIGS. 29-32, respective front, side, and top views of anapparatus 2900 are shown in FIGS. 29-31, and FIG. 32 is a cutaway viewof the apparatus 2900 coupled to the surface mount connector 1200,according to one or more examples of the disclosure. The apparatus 2900may be configured to reduce, and in some instances, prevent deformation(e.g., warpage) of the surface mount connector 1200 subjected to heatenergy during SMT.

To that end, the apparatus 2900 may include an elongated body 2902having a generally rectangular cross section. The elongated body 2902may be constructed to mimic a DIMM and may be metallic or ceramic in oneor more examples. In another example, the elongated body 2902 may beformed from a polymeric material, such as the material used to constructsurface mount connector 1200. The elongated body 2902 may extend betweenthe opposing end portions 408 (one shown) of the surface mount connector1200 and may be sized and configured to be insertable in the socket 406of the surface mount connector 1200. The elongated body 2902 may furtherinclude opposing end portions 2904, each end portion 2904 having anextension 2906 extending from and coplanar with the remainder of theelongated body 2902. As configured, the elongated body 2902 may beinserted into the socket 406 of the surface mount connector 1200 suchthat each extension 2906 of the elongated body 2902 may be engaged witha respective latch 412 of the surface mount connector 1200. In someexamples, each extension 2906 may define a notch (not shown) configuredto further engage with the latch 412.

Accordingly, to couple the apparatus 2900 to the surface mount connector1200 as illustrated in FIG. 32, the elongated body 2902 may be guidedinto alignment with and inserted into the socket 406 of the surfacemount connector 1200. In addition, each latch 412 may at least partiallyextend over and engage with a respective extension 2906 of the elongatedbody 2902 to couple the apparatus 2900 to the surface mount connector1200.

As coupled to the surface mount connector 1200, the apparatus 2900provides structural rigidity to the surface mount connector 1200.Accordingly, during the application of heat energy to the surface mountconnector 1200 in, for example, a reflow oven, and thereafter as thesolder cools, the apparatus 2900 reduces, and in some instances,prevents the end portions 408 of the surface mount connector 1200 fromlifting off the PCB 402 or otherwise warping in shape, thereby resultingin the surface mount connector 1200 remaining flat (i.e., withoutcurvature) during the thermal excursion of the soldering process. As aresult of such, the solder forms appropriate solder joints and anacceptable connection is made between the leads of the surface mountconnector 1200 and the PCB 402. After SMT, the apparatus 2900 may bedecoupled from the surface mount connector 1200 and an electroniccomponent (e.g., DIMM—not shown) may be inserted into the socket 406.

Turning now to FIGS. 33A-36A, respective front, side, and top views ofan apparatus 3300 are shown in FIGS. 33A-35A, and FIG. 36A is a cutawayview of the apparatus 3300 coupled to the surface mount connector 1200,according to one or more examples of the disclosure. The apparatus 3300may be configured to reduce, and in some instances, prevent deformation(e.g., warpage) of the surface mount connector 1200 subjected to heatenergy during SMT.

To that end, the apparatus 3300 may include an elongated body 3302formed from one or more slabs 3304 (one shown). Each slab 3304 may beplanar (i.e., straight) and disposed in a stacked arrangement to formthe elongated body 3302. The number of slabs 3304 in the elongated body3302 may be a function of the desired rigidity and/or weight of theapparatus 3300. The slab(s) 3304 forming the elongated body 3302function as a distributed weight across the top surface 1204 of thesurface connector 1200 to reduce, and is some cases, prevent warpage ofthe surface mount connector 1200. Each slab 3304 may define a pluralityof slots 3306 (two shown). Each slab may further form a tab 3308 at arespective end portion 3310 thereof sized and configured to be insertedin the socket 406 of the respective tower 410. As shown in FIGS.33B-36B, the apparatus 3300 may further include a plurality of threadedfasteners (e.g., screws) 3312 (two shown), a plurality of washers 3314(two shown), and a plurality of retention members (e.g., nuts) 3316 (sixshown). In one or more implementations, each screw 3312 may be acountersunk flat head screw, and an edge of a bottom slab 3304 of thestacked arrangement defining the perimeter of each slot 3306 may bechamfered to match the countersunk, flat head screw. In such animplementation, each screw 3312 may be recessed into the bottom slab3304, thereby avoiding contact with the top surface 1204 of the surfacemount connector 1200 and providing a more evenly applied force.

Prior to coupling the apparatus 3300 to the surface mount connector1200, the apparatus 3300 may be assembled by stacking the slabs 3304 (ifmore than one) one atop the other. In the implementation illustrated inFIGS. 33B-36B, a washer 3314 may be placed over the threaded fastener3312 and the threads of each threaded fastener 3312 may be insertedthrough a slot 3306 of the slab(s) 3304. One or more nuts 3316 may thenbe threaded onto the threaded fastener 3312 and tightened to be flushwith the slab 3304 or an adjacent nut 3316. The placement of the weightassembly (threaded fastener 3312, washer 3314, and nuts 3316) along theelongated body 3302 may mimic the weight blocks applied to the surfacemount connector 1200 as noted above as a previous solution. Accordingly,the number of nuts 3316 used may be chosen to mirror the weight of theweight blocks applied by the previous solution. Additionally, in otherimplementations, other components (e.g., bushings) may be utilized toform the weight assemblies without departing from the scope of thisdisclosure.

To couple the apparatus 3300 to the surface mount connector 1200 asillustrated in FIG. 36A or FIG. 36B, the tabs 3308 of the elongated body3302 may be guided into alignment with and inserted into the respectiveportion of the socket 406 defined by the towers 410 of the surface mountconnector 1200. The slab(s) 3304 may rest on the top surface 1204 of thesurface mount connector 1200. As coupled to the surface mount connector1200, the apparatus 3300 provides structural rigidity to the surfacemount connector 1200. Accordingly, during the application of heat energyto the surface mount connector 1200 in, for example, a reflow oven, andthereafter as the solder cools, the apparatus 3300 reduces, and in someinstances, prevents the end portions 408 of the surface mount connector1200 from lifting off the PCB 402 or otherwise warping in shape, therebyresulting in the surface mount connector 1200 remaining flat (i.e.,without curvature) during the thermal excursion of the solderingprocess. As a result of such, the solder forms appropriate solder jointsand an acceptable connection is made between the leads of the surfacemount connector 1200 and the PCB 402. After SMT, the apparatus 3300 maybe decoupled from the surface mount connector 1200 and an electroniccomponent (e.g., DIMM—not shown) may be inserted into the socket 406.

Turning now to FIGS. 37-40, respective front, side, and top views of anapparatus 3700 are shown in FIGS. 37-39, and FIG. 40 is a cutaway viewof the apparatus 3700 coupled to the surface mount connector 1200,according to one or more examples of the disclosure. The apparatus 3700may be configured to reduce, and in some instances, prevent deformation(e.g., warpage) of the surface mount connector 1200 subjected to heatenergy during SMT.

To that end, the apparatus 3700 may include an elongated body 3702defining a plurality of slots 3704 (two shown). The elongated body 3702may further form a tab 3706 at a respective end portion 3708 thereofsized and configured to be inserted in the socket 406 of the respectivetower 410. The elongated body 3702 may further include a U-shapedextension 3710 at a respective end portion 3708 thereof sized andconfigured to abut the tower 410. In addition, in one or moreimplementations, the apparatus 3700 may include a plurality of weightassemblies (threaded fastener 3312, washer 3314, and nuts 3316) coupledto the elongated body 3702 in a similar fashion to the apparatus 3300.

To couple the apparatus 3700 to the surface mount connector 1200 asillustrated in FIG. 40, the tabs 3706 of the elongated body 3702 may beguided into alignment with and inserted into the respective portion ofthe socket 406 defined by the towers 410 of the surface mount connector1200. With the tabs 3706 in the sockets 406 of the tower 410, theU-shaped extensions 3710 may abut a respective tower 410 and theelongated body 3702 may be disposed on the top surface 1204 of thesurface mount connector 1200. As coupled to the surface mount connector1200, the apparatus 3700 provides structural rigidity to the surfacemount connector 1200. Accordingly, during the application of heat energyto the surface mount connector 1200 in, for example, a reflow oven, andthereafter as the solder cools, the apparatus 3700 reduces, and in someinstances, prevents the end portions 408 of the surface mount connector1200 from lifting off the PCB 402 or otherwise warping in shape, therebyresulting in the surface mount connector 1200 remaining flat (i.e.,without curvature) during the thermal excursion of the solderingprocess. As a result of such, the solder forms appropriate solder jointsand an acceptable connection is made between the leads of the surfacemount connector 1200 and the PCB 402. After SMT, the apparatus 3700 maybe decoupled from the surface mount connector 1200 and an electroniccomponent (e.g., DIMM—not shown) may be inserted into the socket 406.

Turning now to FIGS. 41-44, respective front, side, and top views of anapparatus 4100 are shown in FIGS. 41-43, and FIG. 44 is a cutaway viewof the apparatus 4100 coupled to the surface mount connector 1200,according to one or more examples of the disclosure. The apparatus 4100may be configured to reduce, and in some instances, prevent deformation(e.g., warpage) of the surface mount connector 1200 subjected to heatenergy during SMT.

To that end, the apparatus 4100 may include an elongated body 4102defining a plurality of holes 4104 (only one indicated) along the lengththereof. The elongated body 4102 may further include a plurality of legs4106 (three shown). The elongated body 4102 may include a leg 4102 ateach end portion 4108 of the elongated body 4102 and an additional leg4106 at a center portion of the elongated body 4102. Accordingly, in oneor more examples, the leg 4106 at the center portion may be equidistantfrom the legs 4102 at each end portion 4108. The legs 4102 and 4106 mayextend from the remainder of the elongated body 4102 such that theheight of the apparatus 4100 at each end portion 4108 mimics the heightof a DIMM.

To couple the apparatus 4100 to the surface mount connector 1200, thelegs 4106 of the elongated body 4102 may be guided into alignment withand inserted into the socket 406 of the surface mount connector 1200. Inaddition, each latch 412 may at least partially extend over and engagewith a top surface 4112 of the elongated body 4102 at each end portion4108 of the elongated body 4102 to further couple the apparatus 4100 tothe surface mount connector 1200.

As coupled to the surface mount connector 1200, the apparatus 4100provides structural rigidity to the surface mount connector 1200.Accordingly, during the application of heat energy to the surface mountconnector 1200 in, for example, a reflow oven, the apparatus 4100reduces, and in some instances, prevents the end portions 408 of thesurface mount connector 1200 from lifting off the PCB 402 or otherwisewarping in shape, thereby resulting in the surface mount connector 1200remaining flat (i.e., without curvature) during the thermal excursion ofthe soldering process. As a result of such, the solder forms appropriatesolder joints and an acceptable connection is made between the leads ofthe surface mount connector 1200 and the PCB 402. After SMT, theapparatus 4100 may be decoupled from the surface mount connector 1200and an electronic component (e.g., DIMM—not shown) may be inserted intothe socket 406.

Although each of the apparatus disclosed above are illustrated ascoupling to a “vertical” upright surface mount connector (i.e., surfacemount connectors 400 or 1200), the disclosure is not limited thereto,and in other examples, each of the apparatus of this disclosure may becoupled to a “right angle” socket, whose electronic component contactsare orthogonal to the those of an upright surface mount connector.

As appreciated from the foregoing disclosure, each apparatus disclosedherein may be configured to couple to the surface mount connector 400 or1200 prior to a pick and place operation or, in other examples, afterthe surface mount connector 400 or 1200 is set into a solder pastedisposed on a PCB during SMT. However, in some examples, any apparatusof the present disclosure may be molded as a part of the connectorhousing and removed after solder processing.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the disclosure.However, it will be apparent to one skilled in the art that the specificdetails are not required in order to practice the systems and methodsdescribed herein. The foregoing descriptions of specific examples arepresented for purposes of illustration and description. They are notintended to be exhaustive of or to limit this disclosure to the preciseforms described. Obviously, many modifications and variations arepossible in view of the above teachings. The examples are shown anddescribed in order to best explain the principles of this disclosure andpractical applications, to thereby enable others skilled in the art tobest utilize this disclosure and various examples with variousmodifications as are suited to the particular use contemplated. It isintended that the scope of this disclosure be defined by the claims andtheir equivalents below.

What is claimed is:
 1. An apparatus to reduce or prevent deformation ofa surface mount connector during soldering of the surface mountconnector to a substrate in a reflow oven, the surface mount connectorincluding a connector housing having a top surface, a first housing endportion having defined therein a first portion of a socket, and a secondhousing end portion having defined therein a second portion of a socket,the apparatus comprising: an elongated body having a planar surface tocouple with and contact the top surface of the surface mount connectoralong an entire length of the planar surface, wherein the elongated bodyincludes: a first body end portion forming a first tab insertable intothe first portion of the socket; and a second body end portion forming asecond tab insertable into the second portion of the socket; wherein theentire length of the planar surface extends from a beginning of thefirst body end portion to a beginning of the second body end portion. 2.The apparatus of claim 1, wherein the elongated body is formed from aplurality of slabs in a stacked arrangement.
 3. The apparatus of claim2, wherein the plurality of slabs in a stacked arrangement areconfigured to be disposed on the top surface of the connector housing toprovide a floating weight.
 4. The apparatus of claim 1, wherein thefirst tab and the second tab are each coplanar with the elongated body.5. The apparatus of claim 2, wherein each slab of the the plurality ofslabs includes a plurality of slots.
 6. The apparatus of claim 5,wherein a quantity of slabs included in the plurality of slabs is afunction of a rigidity to reduce or prevent deformation of the surfacemount connector during the soldering.
 7. The apparatus of claim 5,further comprising a weight assembly inserted through a slot of theplurality of slots.
 8. The apparatus of claim 7, wherein the weightassembly includes a threaded fastener inserted through the slot and atleast one nut threaded on the threaded fastener.
 9. The apparatus ofclaim 5, comprising a plurality of weight assemblies inserted throughthe plurality of slots.
 10. The apparatus of claim 1, wherein aremaining portion of the socket, between the first housing end portionand the second housing end portion, is defined by the connector housingand the socket is for receiving an electronic component after thesoldering.
 11. The apparatus of claim 10, wherein the electroniccomponent is a memory module.
 12. The apparatus of claim 1, wherein thesurface mount connector is a Surface Mount Technology (SMT) Double DataRate (DDR) connector.
 13. The apparatus of claim 1, wherein the firsttab and the second tab are sized for insertion into the first housingend portion and the second housing end portion, respectively.
 14. Theapparatus of claim 1, wherein the first tab and the second tab have awidth that is less than a width of the elongated body.
 15. A method forreducing or preventing deformation of a surface mount connector duringsoldering of the surface mount connector to a substrate in a reflowoven, the surface mount connector including a connector housing having atop surface, a first housing end portion having defined therein a firstportion of a socket, and a second housing end portion having definedtherein a second portion of a socket, the method comprising: providingan apparatus that includes an elongated body having a planar surface tocouple with and contact the top surface of the surface mount connectoralong an entire length of the planar surface, wherein the elongated bodyincludes: a first body end portion forming a first tab insertable intothe first portion of the socket, and a second body end portion forming asecond tab insertable into the second portion of the socket, wherein theentire length of the planar surface extends from a beginning of thefirst body end portion to a beginning of the second body end portion;prior to the soldering: distributing a weight of the apparatus across atop surface of the surface mount connector by disposing the elongatedbody on a top surface of the surface mount connector, wherein a planarsurface of the elongated body contacts the top surface of the surfacemount connector along an entire length of the planar surface; insertingthe first tab into the first portion of the socket; and inserting thesecond tab into the second portion of the socket.
 16. The method ofclaim 14, further comprising: inserting a portion of a first weightassembly and a portion of a second weight assembly through respectiveslots in the elongated body; and fastening the first weight assembly andthe second weight assembly to the elongated body.
 17. The method ofclaim 15, wherein said providing comprises forming the elongated body bydisposing a plurality of slabs in a stacked arrangement.
 18. The methodof claim 17, wherein a quantity of slabs included in the plurality ofslabs is a function of a desired rigidity or a desired weight of theelongated body.
 19. The method of claim 15, further comprising after thesoldering: decoupling the apparatus from the surface mount connector;and inserting an electronic component into the socket.